Supermicro BigTwin SuperServer 2029BT-HNC1R (Complete System Only)
6 SAS3 or 4 NVMe + 2 SAS3 Hot-Swap 2.5" Drive Bays per Node
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Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 1 HDD/NVMe and 1 SIOM card per node).
- Compute Intensive Application
- HPC, Data Center, Enterprise Server
- Hyperscale / Hyperconverged
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Dual socket P (LGA 3647) supports Intel Xeon Scalable Processors, Dual UPI up to 10.4GT/s
- Up to 3TB ECC 3DS L/RDIMM, up to DDR4-2666MHz; 24 DIMM slots
- 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking)
Note: must bundle with Network card
- 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays; 2 M.2 SATA3 or NVMe support
- SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
- 1 Carrier Card slot (M.2 support)
- IPMI 2.0 + KVM with dedicated LAN
- Video via Aspeed AST2500 BMC
- 4 Heavy duty 8cm PWM fans with air shroud
- 2200W Redundant Power Supplies Titanium Level (96%)
Supermicro BigTwin - The Industry's Highest Performing Twin Mult-Node System
The Supermicro BigTwin is the first and only 2U multi-node system supporting the highest performance processor, memory, storage, I/O and an incredible 30% better thermal capacity. The 5th generation of Supermicro's Twin architecture is fully optimized for today's diverse workloads and architected for further technology breakthroughs.
- No-compromise 5th Generation Twin architecture delivers the highest performance and efficiency in a 2U 4-node platform.
- The first and only multi-node system that supports the widest TDP range of CPUs (up to 205 watts), fully exploits all memory channels with 24 DIMMs per node and 24 AllFlash NVMe drives.
- 30% better thermal capacity in a compact 2U form factor enables configurations with the highest performance processor, memory, storage and I/O leveraging the Titanium level 96% efficient PowerStick power supplies (2200W/2600W)
- 100% more I/O capacity and added flexibility with more than 10 networking options including 1GbE, 10G, 25G, 100G, IB and industry leading SIOM modular interconnect.
- Each node can support current and next generation dual Intel Xeon processors with up to 3TB of memory, 24 drives of All-Flash NVMe, Hybrid NVMe/SATA/SAS, SSD and HDD, plus 2 m.2 NVMe/SATA per node.
The 5th Generation Twin Architecture
The Supermicro BigTwin is a breakthrough modular multi-node server system that eliminates traditional modular vs rack computing design trade-offs. BigTwin is the 5th generation in the patented Supermicro Twin Family with a multitude of innovations and engineering breakthroughs. The no-compromise architecture delivers the efficiency of multi-node density optimized systems with the full features and power of traditional 1U and 2U rack mount systems.
Rear View of 2U BigTwin Server System Showing 4 Hot-swap DP Nodes and 2 Redundant Power Supplies
A No-Compromise Design
The key benefit of BigTwin is the no-compromise design. Historically multi-node systems traded off features and capacity for higher density. They were deployed for workloads that did not require the highest performance or the highest memory density on a single node. The new 2U BigTwin design is a breakthrough multi-node system that supports the highest performing CPUs, full 24 DIMMs of memory and up to 24 all-flash NVMe SSD drives.
Front View of 2U BigTwin Server System (All-Flash NVMe Model)
All-Flash NVME and 24 DIMMs Per Node
Supermicro has been a leader in introducing NVMe support and advanced NVMe features in our product portfolio and BigTwin continues that tradition. BigTwin supports 24 hotswappable 2.5” U.2 NVMe drives, or mixed configurations with SAS3 and SATA3 drives (varies by different BigTwin models).
Leveraging Supermicro’s building block architecture BigTwin is a shared design with common components where most multi-node systems are one-off designs with limited leverage and integration to the rest of the product family creating sub-optimal service, sparing and training. The building block design also allows the system to be optimized to the specific requirements of the intended workload.
The 24 DIMMs can be used to deliver better performance and responsiveness for database and cloud infrastructure workloads, as well as providing the flexibility to customers looking to invest in lower capacity DIMMs for lowered dollar per GB solutions.
Maximum Memory Support Per Node on 3 Different 2U Twin Architecture Generations
Each BigTwin Server Supports up to
- 4 hot-swappable DP nodes in 2U
- 24 DIMMs per node
- 6 NVMe / SAS / SATA drives per node
- 1 SIOM card support per node
- 2 low-profile PCI-E x16 slots per node
- Redundant 2200W Titanium Level (96%) Power Supplies
A hyper-converged solution of 3 nodes plus a hot spare can be hosted by just one BigTwin server. Each node can support dual Intel Xeon E5-2600 v4/v3 processors with up to 3TB of memory, 2 NVMe SSD drives for caching and 4 SAS drives for datastore.
The Supermicro BigTwin is a breakthrough modular multi-node server system, an ultradense and energy efficient powerhouse that provides industry leading performance perwatt, per-dollar, and per-squarefoot.
BigTwin’s 96% Efficiency 2200W Power Stick Design
SIOM: Supermicro Optimized Flexible Networking for 1GB/s to 100GB/s
Supermicro Super I/O Module (SIOM), common across both Rack and Modular platforms, delivers up to 50% I/O cost savings and freedom to select networking options from 1Gb/s to 100Gb/s. The SIOM enables a tighter system integration and leaves a total of two PCI-E 3.0 x16 LP slots for storage or networking add-on-cards on each node.
Example SIOM options
|SIOM Modules||Networking Features|
|AOC-MH25G-m2S2T||Dual-port 25 Gigabit Ethernet SFP28 and Dual-port 10 Gigabit Ethernet RJ45|
|AOC-MHIBF-m2Q2G||Dual-port FDR InfiniBand QSFP+ and Dual-port Gigabit Ethernet RJ45|
|AOC-MTG-i4S||Quad-port 10 Gigabit Ethernet SFP+|
|AOC-MGP-i4||Quad-port Gigabit Ethernet RJ45|
|SuperServer 2029BT-HNC1R (Black) Specifications|
|Processor/Cache (per Node)|
|Cores||Up to 28 Cores with Intel HT Technology|
|Note||* 200W/205W CPUs are supported under certain configurations. Please contact Supermicro Technical Support for additional information about specialized system optimization|
|System Memory (per Node)|
|Memory Type||2666/2400/2133MHz ECC DDR4 SDRAM|
|Chipset||Intel C621 chipset|
|SAS||SAS3 (12Gbps) via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60|
|Network||Must bundle with at least one SIOM network card|
|Video||ASPEED AST2500 BMC|
|Input / Output (per Node)|
|LAN||1 RJ45 Dedicated IPMI LAN port|
|USB||2 USB 3.0 ports (rear)|
|Video||1 VGA port|
|DOM||1 SuperDOM (Disk on Module) port|
|Others||M.2 and SATA DOM for boot drive only|
|BIOS Type||AMI 32Mb SPI Flash ROM|
|Power Configurations||ACPI / APM Power Management|
|PC Health Monitoring|
|Form Factor||2U Rackmount|
|Dimensions and Weight|
|Package||24.65" (H) x 9.76" (W) x 45.28" (D)|
|Expansion Slots (per Node)|
|Drive Bays / Storage (per Node)|
|Hot-swap||6 Hot-swap 2.5" SAS3 drive bays or 4 NVMe + 2 SAS3 Hot-swap 2.5"
Please contact Supermicro Technical Support for additional information about HDD and SSD if mixed. Some restrictions and configuration rules that apply to SSD are different from HDD.
|M.2||2 M.2 NVMe or SATA (2240/2260/2280) via optional AOC-SMG3-2H8M2-B|
|Fans||4 Heavy duty 8cm PWM fans with air shroud|
|Power||2200W Redundant Power Supplies with PMBus|
|Total Output Power||1200W/1800W/1980W/2090/2200W|
|Dimension (W x H x L)||45 x 40 x 480 mm|
|12Vsb||Max: 2.1A / Min: 0A|
|Output Type||Gold Finger|
[ Cert. in progress ]
|Parts List - (Items Included)|
|Motherboard / Chassis||MBD-X11DPT-B||4||Super X11DPT-B Motherboard|
|Add-on Card / Module||AOC-S3108L-H8IR-16DD-P||4||AOC-S3108L-H8iR-16DD|
|Backplane||BPN-ADP-6SATA3H4-1UB||4||Hybrid BPN to support 4 SATA and/or NVMe in addition to 2 SATA ports,HF,RoHS|
|BPN-SAS3-217BHQ-N4||1||2U 4-Node 24-Port Backplane Supports 2x2.5\" SATA3/SAS3 SSD/HDD and 4x2.5\" SATA3/SAS3/NVMe Stoage Media per Node|
|Cable 1||CBL-PWCD-0578||2||PWCD,US,IEC60320 C14 TO C13,3FT,14AWG|
|Cable 2||CBL-SAST-0846-1||4||SLIMLINE SAS to MiniSAS HD 2X,INT,48CM, SB|
|Drive Tray(s)||MCP-220-00141-0B-BULK||8||Black Gen3 hot-swap 2.5 inch HDD tray with lock improved EMI|
|MCP-220-00144-0B-BULK||16||Black Gen3 hot-swap 2.5 inch HDD tray with lock, orange tab|
|Parts||MCP-240-21730-0N||1||217B BigTwin type I (Impact) BPN retention bkt w/ foam assy|
|Air Shroud||MCP-310-21712-0B||4||SC217B/827B BigTwin air box for X11DRT-B+|
|MCP-310-21718-0B||4||Bigtwin air box for X11DPT-B(4pcs/set)|
|Manual||MNL-1948-QRG||1||2029BT-H(N/T/NC0)R Quick Reference Guide|
|Riser Card||RSC-P-6||4||RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS|
|RSC-R1UTP-E16R||4||1U RHS TwinPro Riser card with one PCI-E x16 slot|
|Heatsink / Retention||SNK-P0067PS||4||1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism|
|SNK-P0067PSM||4||1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism|
|Power Supply||PWS-2K22A-1R||2||1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48|
|Optional Parts List|
|TPM security module||AOM-TPM-9670H||1||SPI capable TPM 2.0 with Infineon 9670 controller, Horizontal form factor|
|AOM-TPM-9671H||1||SPI capable TPM 1.2 with Infineon 9670 controller, Horizontal form factor|
|Intel VROC RAID Key||AOC-VROCINTMOD||1||Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only)|
|AOC-VROCSTNMOD||1||Intel VROC Standard, RAID 0, 1, 10|
|AOC-VROCPREMOD||1||Intel VROC Premium, RAID 0, 1, 5, 10|
|Global Services & Support||OS4HR3/2/1||-||3/2/1-year onsite 24x7x4 service|
|OSNBD3/2/1||-||3/2/1-year onsite NBD service|
|Software||SFT-OOB-LIC||1||OOB Management Package (per node license)|
|SFT-DCMS-Single||1||DataCenter Management Package (per node license)|
|SuperDOM||-||-||Supermicro SATA DOM Solutions|
|Standard LP 2-port 40GbE controller, based on Intel Fortville XL710
Standard LP, 2x GbE RJ45, PCI-E x4, Intel i350AM2
Standard LP, 4x GbE RJ45, PCI-E x4, Intel i350
Standard LP, 4x 10GbE SFP+, PCI-E x8, Broadcom BCM57840S
Standard LP, 2x 10GbE SFP+, PCI-E x8, Intel 82599ES
Standard LP, 1x 10GbE SFP+, PCI-E x8, Intel 82599EN
Standard LP, 2x 10GbE RJ45, PCI-E x8, Intel X540
Standard LP, 2x 10GbE CX4, PCI-E x8, Intel 82598EB
|-||2 Hybrid NVMe/SATA M.2 carrier for Big Twin,HF,RoHS
2 SATA M.2 RAID adapter for Big Twin,HF,RoHS
|Cache Protection for RAID Card||BTR-TFM8G-LSICVM02 & BKT-BBU-BRACKET-05||-||CacheVault for Broadcom 3108; Supercap mounting bracket for PCI-E location|
Angled View - System
Angled View - Node
Front View - System
Rear View - System
X11DPT-B (For SuperServer Only)
- Intel Xeon Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
- Intel C621
- Up to 3TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots
- 1 PCI-E 3.0 x16 Left Riser Slot
1 PCI-E 3.0 x16 Right Riser Slot
1 PCI-E 3.0 x24 Proprietary Slot (for Supermicro storage add-on card),
1 PCI-E 3.0 x16 SIOM LAN Networking Slot
1 PCI-E 3.0 x8 Proprietary Slot (For M.2 add-on card)
- 1 VGA port
- Intel C621 controller for SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Single LAN with Networking options provided via SIOM module
|Form Factor||Proprietary Twin|
|Dimensions||7.62" x 18.86" (19.35cm x 47.9cm)|
|Processor/Cache (per Node)|
|Cores / Cache||Up to 28 cores|
|Memory Capacity||Up to 3TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots|
|Memory Type||2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM|
|SATA||Intel C621 controller for SATA3 (6 Gbps) ports; RAID 0,1,5,10|
|Network Controllers||Single LAN with Networking options provided via SIOM module|
|Graphics||Aspeed AST2500 BMC|
|Input / Output|
|SATA||8 SATA3 (6Gbps) port|
|USB||2 USB 3.0 ports (2 rear)|
|Video Output||1 VGA port|
|TPM||1 TPM Header|
|BIOS Type||AMI UEFI|
|Software||Intel Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor 5, Watchdog|
|Power Configurations||ACPI Power Management|
|PC Health Monitoring|
|Voltage||+1.8V, +12V, +3.3V, +5V, +5V standby, Chassis intrusion header, Monitors CPU voltages, Supports system management utility, System level control|
|FAN||2x 4-pin fan headers (up to 2 fans), Fan speed control, Overheat LED indication, Pulse Width Modulated (PWM) fan connectors|
|Temperature||CPU thermal trip support, Monitoring for CPU and chassis environment, PECI|
|LED||CPU / System Overheat LED, Suspend static indicator LED, UID/Remote UID|
|Other Features||Chassis intrusion detection, CPU thermal trip support for processor protection, Node Manager Support, RoHS|
|Operating Temperature Range||10°C - 35°C (50°F - 95°F)|
|Non-Operating Temperature Range||-40°C - 70°C (-40°F - 158°F)|
|Operating Relative Humidity Range||8% - 90% (non-condensing)|
|Non-Operating Relative Humidity Range||5% - 95% (non-condensing)|
Supermicro SuperMinute: X11 BigTwin
Supermicro introduces its 5th generation Twin architecture the X11 BigTwin. With its no-compromise design, it is the industry’s highest performing 2U multi-node platform.
Supermicro BigTwin Product Loop
Introducing BigTwin, the IT industry’s highest performing twin multi-node system with 4 nodes in 2U supporting the highest performance 205-watt DP Intel Xeon E5-2600 v4/v3 product families, a full 24 DIMMs of memory per node, 24 All-Flash NVMe or hybrid drives, three PCI-E 3.0 x16 I/O options per node, and an industry leading 30% better thermal capacity for maximum performance, efficiency and free air cooling (1.05 PUE). With Supermicro’s 96%+ high-efficiency, fully redundant 2200W, 2600W PowerStick design and advanced thermal architecture.
The BigTwin is optimized for today and future proofed for the next generation of technology breakthroughs advancements, including new generation Intel Skylake processors.
Download the Supermicro BigTwin Datasheet (.PDF)
- Pricing and product availability subject to change without notice.
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