Supermicro BigTwin SuperServer 2029BZ-HNR (Complete System Only)
6 Hot-Swap 2.5" NVMe Drive Bays per Node and N+1 Cooling

Overview:

Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 1 NVMe and 1 SIOM card per node).

Key Features

• Compute Intensive Application
• HPC, Data Center, Enterprise Server
• Hyperscale / Hyperconverged

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

• Dual socket P (LGA 3647) supports Intel Xeon Scalable Processors, Dual UPI up to 10.4GT/s
• Up to 3TB ECC 3DS L/RDIMM, up to DDR4-2666MHz; 24 DIMM slots
• 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking)
  Note: must bundle with Network card
• 6 Hot-swap 2.5" NVMe drive bays; 2 M.2 SATA3 or NVMe support
• 1 Carrier Card slot (M.2 support)
• IPMI 2.0 + KVM with dedicated LAN
• Video via Aspeed AST2500 BMC
• 16 Heavy duty 40x56mm fans with optimal fan speed control (4 fans per node)
• 2200W Redundant Power Supplies Titanium Level (96%)

Supermicro BigTwin - The Industry's Highest Performing Twin Mult-Node System

The Supermicro BigTwin is the first and only 2U multi-node system supporting the highest performance processor, memory, storage, I/O and an incredible 30% better thermal capacity. The 5th generation of Supermicro's Twin architecture is fully optimized for today's diverse workloads and architected for further technology breakthroughs.

• No-compromise 5th Generation Twin architecture delivers the highest performance and efficiency in a 2U 4-node platform.
• The first and only multi-node system that supports the widest TDP range of CPUs (up to 205 watts), fully exploits all memory channels with 24 DIMMs per node and 24 AllFlash NVMe drives.
• 30% better thermal capacity in a compact 2U form factor enables configurations with the highest performance processor, memory, storage and I/O leveraging the Titanium level 96% efficient PowerStick power supplies (2200W/2600W)
• 100% more I/O capacity and added flexibility with more than 10 networking options including 1GbE, 10G, 25G, 100G, IB and industry leading SIOM modular interconnect.
• Each node can support current and next generation dual Intel Xeon processors with up to 3TB of memory, 24 drives of All-Flash NVMe, Hybrid NVMe/SATA/SAS, SSD and HDD, plus 2 m.2 NVMe/SATA per node.

Features:

The 5th Generation Twin Architecture

The Supermicro BigTwin is a breakthrough modular multi-node server system that eliminates traditional modular vs rack computing design trade-offs.  BigTwin is the 5th generation in the patented Supermicro Twin Family with a multitude of innovations and engineering breakthroughs.  The no-compromise architecture delivers the efficiency of multi-node density optimized systems with the full features and power of traditional 1U and 2U rack mount systems.

Rear View of 2U BigTwin Server System Showing 4 Hot-swap DP Nodes and 2 Redundant Power Supplies

A No-Compromise Design

The key benefit of BigTwin is the no-compromise design.  Historically multi-node systems traded off features and capacity for higher density.  They were deployed for workloads that did not require the highest performance or the highest memory density on a single node. The new 2U BigTwin design is a breakthrough multi-node system that supports the highest performing CPUs, full 24 DIMMs of memory and up to 24 all-flash NVMe SSD drives.

Front View of 2U BigTwin Server System (All-Flash NVMe Model)

Applications

A hyper-converged solution of 3 nodes plus a hot spare can be hosted by just one BigTwin server. Each node can support dual Intel Xeon E5-2600 v4/v3 processors with up to 3TB of memory, 2 NVMe SSD drives for caching and 4 SAS drives for datastore.

The Supermicro BigTwin is a breakthrough modular multi-node server system, an ultradense and energy efficient powerhouse that provides industry leading performance perwatt, per-dollar, and per-squarefoot.

BigTwin’s 96% Efficiency 2200W Power Stick Design

SIOM: Supermicro Optimized Flexible Networking for 1GB/s to 100GB/s

Supermicro Super I/O Module (SIOM), common across both Rack and Modular platforms, delivers up to 50% I/O cost savings and freedom to select networking options from 1Gb/s to 100Gb/s. The SIOM enables a tighter system integration and leaves a total of two PCI-E 3.0 x16 LP slots for storage or networking add-on-cards on each node.

Example SIOM options

SIOM Modules	Networking Features
AOC-MH25G-m2S2T	Dual-port 25 Gigabit Ethernet SFP28 and Dual-port 10 Gigabit Ethernet RJ45
AOC-MHIBF-m2Q2G	Dual-port FDR InfiniBand QSFP+ and Dual-port Gigabit Ethernet RJ45
AOC-MTG-i4S	Quad-port 10 Gigabit Ethernet SFP+
AOC-MGP-i4	Quad-port Gigabit Ethernet RJ45

Specifications:

SuperServer 2029BZ-HNR (Black) Specifications
Motherboard	Super X11DPT-B
Processor/Cache (per Node)
CPU	Dual Socket P (LGA 3647) Intel Xeon Scalable Processors, Dual UPI up to 10.4GT/s Support CPU TDP 70-205W*
Cores	Up to 28 Cores with Intel HT Technology
Note	* 200W/205W CPUs are supported under certain configurations. Please contact Supermicro Technical Support for additional information about specialized system optimization
System Memory (per Node)
Memory Capacity	24 DIMM slots Up to 3TB ECC 3DS LRDIMM, 3TB ECC RDIMM, DDR4 up to 2666MHz
Memory Type	2666/2400/2133MHz ECC DDR4 SDRAM
On-Board Devices
Chipset	Intel C621 chipset
Network	Must bundle with at least one SIOM network card
IPMI	Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video	ASPEED AST2500 BMC
Input / Output (per Node)
LAN	1 RJ45 Dedicated IPMI LAN port
USB	2 USB 3.0 ports (rear)
Video	1 VGA port
DOM	1 SuperDOM (Disk on Module) port
Others	M.2 and SATA DOM for boot drive only
System BIOS
BIOS Type	AMI 32Mb SPI Flash ROM
Management
Software	Intel Node Manager IPMI 2.0 KVM with dedicated LAN SSM, SPM, SUM SuperDoctor 5 Watch Dog
Power Configurations	ACPI / APM Power Management
PC Health Monitoring
CPU	Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN	Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature	Monitoring for CPU and chassis environment Thermal Control for fan connectors
Chassis
Form Factor	2U Rackmount
Model	CSE-217BHQ+-R2K22BP2
Dimensions and Weight
Width	17.6" (447mm)
Height	3.47" (88mm)
Depth	28.75" (730mm)
Package	24.65" (H) x 9.76" (W) x 45.28" (D)
Weight	Gross Weight: 85 lbs (38.6kg) Net Weight: 54.5 lbs (24.7 kg)
Available Colors	Black
Front Panel
Buttons	Power On/Off button UID button
LEDs	Power status LED HDD activity LED Network activity LEDs Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express	2 PCI-E 3.0 (x16) Low-profile slots 1 SIOM card support (must bundle with network card)
Drive Bays / Storage (per Node)
Hot-swap	6 Hot-swap 2.5" NVMe drive bays
M.2	2 M.2 NVMe or SATA (2240/2260/2280) via optional AOC-SMG3-2H8M2-B
System Cooling
Fans	16 Heavy duty 40x56mm PWM fans with air shroud (4 fans per node)
Power Supply
Power	2600W Redundant Power Supplies with PMBus
Total Output Power	2600W
Dimension (W x H x L)	45 x 40 x 480 mm
Input	208-240Vac/15-12.5A / 50-60Hz 220-240Vdc/13.5-12.5A (CQC only)
+12V	Max: 216.6A / Min: 0A
12Vsb	Max: 4.5A / Min: 0A
Output Type	Gold Finger (4HP+2LP-20S output connector)
Certification	UL/cUL/CB/BSMI/CE/CCC Titanium Level [ Cert. in progress ]
Operating Environment
RoHS	RoHS Compliant
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)

Parts List:

Parts List - (Items Included)
	Part Number	Qty	Description
Motherboard / Chassis	MBD-X11DPT-BH	4	Super X11DPT-B Motherboard
	CSE-217BHQ+-R2K60FP	1	2U Chassis
Backplane	BPN-ADP-6NVME3-1UB	4	6x NVMe ports and 50A power sourcing daughter card for Big Twin
	BPN-NVME3-217BHQ	1	2U 24-Port 4-Node NVMe Backplane Support 6x2.5
Cable 1	CBL-PWCD-0376-IS	2	PWCD,US,IEC60320 C19 TO C20,940mm (3ft),14AWG,15A,250V,Black
Drive Tray(s)	MCP-220-00127-0B-BULK	24	Black gen3 Hotswap 2.5 NVMe drive tray, Orange tab/Lock/Bulk
Air Shroud	MCP-310-21719-0B	4	Bigtwin mylar air shroud for X11DPT-BH (4CM fan chassis)
	MCP-310-21720-0B	4	Bigtwin plastic air shroud for X11DPT-BH (4CM fan chassis)
Manual	MNL-1948-QRG	1	2029BT-H(N/T/NC0)R Quick Reference Guide
Riser Card	RSC-P-6	4	RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
	RSC-R1UTP-E16R	4	1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention	SNK-P0067PSMB	4	1U Passive High Performance Front CPU Heat Sink w/ an 18-mm Wide Middle Air Channel for X11 Purley Platform Equipped w/ a Narrow Retention Mechanism/Bolster
	SNK-P0071VS	4	1U Proprietary Passive CPU Heat Sink (124 mm Long) for SYS-2029BZ-HNR Series Servers (X11 2U4N 3UPI Big Twin)
Power Supply	PWS-2K60A-1R	2	1U 2600W Redundant Titanium PWS, 45(W) X 40(H) X 480(L)
Optional Parts List
	Part Number	Qty	Description
TPM security module	AOM-TPM-9670H	1	SPI capable TPM 2.0 with Infineon 9670 controller, Horizontal form factor
	AOM-TPM-9671H	1	SPI capable TPM 1.2 with Infineon 9670 controller, Horizontal form factor
Intel VROC RAID Key	AOC-VROCINTMOD	1	Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only)
	AOC-VROCSTNMOD	1	Intel VROC Standard, RAID 0, 1, 10
	AOC-VROCPREMOD	1	Intel VROC Premium, RAID 0, 1, 5, 10
Global Services & Support	OS4HR3/2/1	-	3/2/1-year onsite 24x7x4 service
	OSNBD3/2/1	-	3/2/1-year onsite NBD service
Software	SFT-OOB-LIC	1	OOB Management Package (per node license)
	SFT-DCMS-Single	1	DataCenter Management Package (per node license)
SuperDOM	-	-	Supermicro SATA DOM Solutions
Network Card(s)	AOC-S40G-i2Q AOC-SGP-i2 AOC-SGP-i4 AOC-STG-b4S AOC-STGN-i2S AOC-STGN-i1S AOC-STG-i2T AOC-STG-i2	- - - - - - - -	Standard LP 2-port 40GbE controller, based on Intel Fortville XL710 Standard LP, 2x GbE RJ45, PCI-E x4, Intel i350AM2 Standard LP, 4x GbE RJ45, PCI-E x4, Intel i350 Standard LP, 4x 10GbE SFP+, PCI-E x8, Broadcom BCM57840S Standard LP, 2x 10GbE SFP+, PCI-E x8, Intel 82599ES Standard LP, 1x 10GbE SFP+, PCI-E x8, Intel 82599EN Standard LP, 2x 10GbE RJ45, PCI-E x8, Intel X540 Standard LP, 2x 10GbE CX4, PCI-E x8, Intel 82598EB
Carrier Card	AOC-SMG3-2H8M2-B	-	2 Hybrid NVMe/SATA M.2 carrier for Big Twin,HF,RoHS
	AOC-SMG2-2TM2	-	2 SATA M.2 RAID adapter for Big Twin,HF,RoHS

Views:

Angled View - System

Angled View - Node

Front View - System

Rear View - System

Integrated Board:

X11DPT-B (For SuperServer Only)

Key Features

• Intel Xeon Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
• Intel C621
• Up to 3TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots
• 1 PCI-E 3.0 x16 Left Riser Slot
  1 PCI-E 3.0 x16 Right Riser Slot
  1 PCI-E 3.0 x24 Proprietary Slot (for Supermicro storage add-on card),
  1 PCI-E 3.0 x16 SIOM LAN Networking Slot
  1 PCI-E 3.0 x8 Proprietary Slot (For M.2 add-on card)
• 1 VGA port
• Intel C621 controller for SATA3 (6 Gbps) ports; RAID 0,1,5,10
• Single LAN with Networking options provided via SIOM module

X11DPT-B Specifications
Physical Stats
Form Factor	Proprietary Twin
Dimensions	7.62" x 18.86" (19.35cm x 47.9cm)
Processor/Cache (per Node)
CPU	Intel Xeon Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Cores / Cache	Up to 28 cores
System Memory
Memory Capacity	Up to 3TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots
Memory Type	2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes	RDIMM: 64GB LRDIMM: 64GB 3DS LRDIMM: 128GB
Memory Voltage	1.2V
Error Detection	Corrects single-bit errors Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset	Intel C621
SATA	Intel C621 controller for SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI	ASPEED AST2500
Network Controllers	Single LAN with Networking options provided via SIOM module
Graphics	Aspeed AST2500 BMC
Input / Output
SATA	8 SATA3 (6Gbps) port
USB	2 USB 3.0 ports (2 rear)
Video Output	1 VGA port
TPM	1 TPM Header
Expansion Slots
PCI-E	1 PCI-E 3.0 x16 Left Riser Slot, 1 PCI-E 3.0 x16 Right Riser Slot 1 PCI-E 3.0 x24 Proprietary Slot (for Supermicro storage add-on card), 1 PCI-E 3.0 x16 SIOM LAN Networking Slot, 1 PCI-E 3.0 x8 Proprietary Slot (For M.2 add-on card)
System BIOS
BIOS Type	AMI UEFI
Management
Software	Intel Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor 5, Watchdog
Power Configurations	ACPI Power Management
PC Health Monitoring
Voltage	+1.8V, +12V, +3.3V, +5V, +5V standby, Chassis intrusion header, Monitors CPU voltages, Supports system management utility, System level control
FAN	2x 4-pin fan headers (up to 2 fans), Fan speed control, Overheat LED indication, Pulse Width Modulated (PWM) fan connectors
Temperature	CPU thermal trip support, Monitoring for CPU and chassis environment, PECI
LED	CPU / System Overheat LED, Suspend static indicator LED, UID/Remote UID
Other Features	Chassis intrusion detection, CPU thermal trip support for processor protection, Node Manager Support, RoHS
Operating Environment
Operating Temperature Range	10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range	-40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range	8% - 90% (non-condensing)
Non-Operating Relative Humidity Range	5% - 95% (non-condensing)

Videos:

Supermicro SuperMinute: X11 BigTwin

Supermicro introduces its 5th generation Twin architecture the X11 BigTwin. With its no-compromise design, it is the industry’s highest performing 2U multi-node platform.

Supermicro BigTwin Product Loop

Introducing BigTwin, the IT industry’s highest performing twin multi-node system with 4 nodes in 2U supporting the highest performance 205-watt DP Intel Xeon E5-2600 v4/v3 product families, a full 24 DIMMs of memory per node, 24 All-Flash NVMe or hybrid drives, three PCI-E 3.0 x16 I/O options per node, and an industry leading 30% better thermal capacity for maximum performance, efficiency and free air cooling (1.05 PUE). With Supermicro’s 96%+ high-efficiency, fully redundant 2200W, 2600W PowerStick design and advanced thermal architecture.

The BigTwin is optimized for today and future proofed for the next generation of technology breakthroughs advancements, including new generation Intel Skylake processors.

Documentation:

Download the Supermicro BigTwin Datasheet (.PDF)